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Product List
Key features of the DBC or Direct Bonded Copper package devices with enhanced thermal conductivity, as compared to the FM package devices. The vacuum soldering process is used to mount the power devices, eliminating solder voids under the IGBT and FWD die to reduce hot-spotting and improve thermal performance and reliability. These devices all use Trench Gate Field Stop IGBT technology and have improved soft recovery freewheeling diodes. The NTC temperature sensing option is placed on the power side, near the IGBTs. Also included is the smart shutdown feature that was introduced in some of our earlier Gen 1 SLLIMM products.
PTM Published on: 2015-03-31
