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Product List
The SLLIMM Gen 2 package positioning is shown on this slide, with end product applications on the vertical axis and power on the horizontal axis. The FM package targets lower power applications due to its lesser capability of removing heat from the IGBTs, as the heat must be conducted away from the devices through the epoxy package. It has lower thermal conductivity than the more effective Direct Bonded Copper package. The DBC package targets higher power and performance applications that can support its higher cost.
PTM Published on: 2015-03-31
