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IGBT and SLLIMM IPM Slide 23

The other benefit of the vacuum soldering process is that it provides a very reliable and repeatable die attachment process, giving very little statistical variation in thermal resistance from die to die and from packaged device to packaged device. This guarantees the devices may be used to their full capability without any de-rating required to account for lot variations in thermal resistance.

PTM Published on: 2015-03-31