Going to a leadless package solution brings a lot benefits in addition to the space savings. First, it allows a larger die to fit inside the same footprint as a leaded package; therefore, better performance can be achieved per square area. As an alternative, a smaller solution can also be provided with the same electrical characteristics. NXP leadless packages are characterized over an extended temperature range of -40 to 125 degrees Celsius. Typical devices found on the market only go up to 85 degrees Celsius. This makes NXP leadless devices suitable for high stress environments, such as those found in automotive and military applications. Reliability is also superior to WCSP and leaded packages. Offering better adhesion to the PCB and being more impervious to chipping around the edges, these packages yield far less failures during assembly and the overall life of the end product. In addition, the package leads are coated with nickel palladium gold to prevent oxidation when exposed to air. This allows for an unlimited storage life time while out of the bag and negligible loss of inventory. All leadless packages are Pb-free, RoHS and Dark Green compliant.