The packaging trend as driven by the market has always been toward smaller, cheaper, and more reliable packages. The large through hole dip packages were succeeded by the lower profile surface mount SO, followed by the TSSOP, and finally the leadless ball mounted or surface mount packages, like BGA, WCSP, and DQFN types. In parallel, the lower pin count packages similarly migrated from SOT type of packages to picogate and MicroPak, bringing more space savings.