This chart depicts the relative price impact to go to a smaller footprint for various types of packages. It clearly points out the cost/size advantage of a leadless solution over leaded or BGA packages. For a slight premium, going from leaded (TSSOP, for example) to a leadless solution drastically reduces the PCB area occupied by a device. In comparison, going to a BGA/WCSP type helps brings significant space savings as well, but at a much greater cost. The same trend can be observed for higher pin count packages. The BQ leadless package provides a good cost-to-space-savings incentive compared to a BGA option.