Welcome to the NXP Logic Packages product training module. This module will introduce NXP’s package offering for logic, analog switches and voltage translators. It will first cover NXP’s comprehensive leadless package portfolio, giving particular attention to package height and pitch, which are becoming critical in portable applications. A review of the benefits of leadless packages will be provided after this, closely looking at the MicroPak and secure leadless package examples. The module will conclude with a comparison between the MicroPak package and wafer chip scale package to understand reliability differences.