NXP offers a very wide array of leadless package solutions. Available in a variety of form factors, they are ideal replacements for the large leaded legacy packages such as SO, TSSOP, SSOP, the widely used SOT packages, or the various wafer chip scale and ball grid array packages. As this presentation will demonstrate later, leadless packages bring many benefits. They allow for PCB space saving by providing a smaller footprint replacement, while maintaining performance and improving reliability.