The first obvious advantage of a leadless package over a leaded one is the space savings. Assembly rules require a certain margin clearance between the edge of a die and the side of the package in which it is being integrated. This safety margin essentially limits the maximum die size that can be integrated in a package. In a leadless package, the leads are essentially “tucked-in” and under the package, as opposed to hanging off on the side of the package. So for the same body size, a leadless package effectively occupies less PCB area and still allows the use of the same die size. This allows great space savings as will be shown on the next slide. The second advantage of a leadless package over a leaded package is the enhanced reliability. Because of its lower profile and its ability to be directly mounted against the PCB with virtually no air gap, a leadless package has better adhesion to the board. This feature alone greatly improves assembly yields and drop test results.