Further space savings can be obtained by reducing the distance from lead to lead, called pitch, to achieve a more compact design. This chart shows the space savings realized by going from a 0.5mm pitch to a 0.35mm pitch and to a 0.3mm pitch package. As the chart points out, a 40% PCB space savings can be realized by switching from a 0.5mm pitch, 6 lead package, to a 0.3mm pitch GN equivalent. The NXP MicroPak family of leadless packages is offered in those three pitch sizes for all logic functions, switches and translators. The standard package height for the 0.5mm and 0.35mm is 0.5mm. The 0.35mm and 0.3mm pitch packages are also available in 0.35mm height for applications requiring low profile packages, such as in a thin cell phone, near the edges of the PC board.