A batch of ten parts was submitted to the pull test and shear test. The results are highlighted in these tables. On average, the Micropak package can withstand up to 10 Newtons of pull and shear force before breaking loose from the PCB. In comparison, the chip scale package can only withstand 4.4 to 4.7 Newtons of force. This is less than half the amount of force that it took to displace the MicroPak. So a chip scale package is a lot easier to lift off a board than a MicroPak. The conclusion of this study is that NXP’s MicroPak on a wafer chip scale footprint provides better robustness and will yield higher reliability during a drop test.