In summary, NXP provides a large portfolio of leadless packages as an alternative to most leaded and wafer chip scale packages. It offers one of the most advanced package roadmaps, along with one of the lowest profiles and smallest pitches on the market. The MicroPak family brings countless benefits in terms of performance, size, reliability, and cost, over other packages that are currently offered. For more information on NXP package offering, please go online at http://ics.nxp.com/packaging/ or contact DigiKey Technical Support.