NXP’s low power Class D amplifiers are available in 3 package types: Chip Scale (CSP), HVSON, and HVQFN. Each package has its own advantages and features. The Chip Scale Packaging (CSP) reduces board space and construction material requirements because the device is the same size as the die itself. This eliminates much of the handling and lead co-planarity requirements, and provides minimum thermal path from die to board. The package is also moisture insensitive, and cost effective (no packaging material). The HVSON and HVQFN Exposed Die Attach Pad provides higher power output due to lower package thermal resistance typically around 20°K/W, which is lower than a SO20 package.