Compared to devices housed in ceramic packages, the new family of products housed in ST’s innovative STAC® air cavity package feature a lower thermal resistance (up to 25%) and higher MTTF (almost 4 times) combined with improved RF performances and ruggedness requirements. Two options are available – The Boltdown “B” version to screw down the device or the surface mount “F” version to be solder reflowed directly on heatsink. As an option, ST can offer the surface mount “F” version with AgSnCu back solder finishing which will simplify the solder reflow process at customer production line.