Another very effective IC design technique engineers can apply is to arrange the Vcc and GND terminals on the package in an optimum way, quite close to one another. The resulting pin layout of the package will make it easy to mount bypass capacitors near and directly across those terminals, where they will be most effective in reducing noise emissions from the microcontroller. Additionally, if the MCU designers can make the wiring of the signal lines parallel inside the package and on the semiconductor chip, they can build into the microcontroller effective noise filters that are comprised merely of wiring inductance and parasitic capacitance.