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Image of Octavo Systems Overview of the OSD32MP1 System-in-Package Family - Optimized BGA

In addition to the simplification of the actual design, the OSD32MP1 significantly simplifies the layout process through the design of the ball map on the system-in-package. A 302 ball BGA 1mm pitch gives access to all the I/O's that are on the MP1. Octavo Systems has arranged those I/O's in an intelligent manner that allows designers to access all of the I/O's on the outer three layers with power and ground pins all in the center.

PTM Published on: 2021-08-02