At 18mm by 18mm, the OSD32MP15x system-in-package device is up to 64% smaller than an equivalent design using discrete components. Utilizing a SiP removes tedious design tasks and allows designers to focus on differentiation and getting to market faster. With the SiP, the customer still gets access to all of the I/O and all of the peripherals available on the MP1. In addition, the customer gets the PMIC with all of its functionality and integrated with it the DDR, EEPROM, oscillators, and all of the passives, in a BGA package about the same size as versions of the MP1 standalone. The OSD32MP1 reduces the cost of PCBs and assembly while increasing reliability of a system. Getting started with the OSD32MP1 is easy because the SiP is compatible with all ST32MP1 tools and software from ST Microelectronics. Designers can choose from either a commercial or industrial grade device.