The OSD32MP1 system-in-package lowers the total cost of ownership. By using the SiP, designers can save about nine months of design time which is a significant savings in engineering cost. Due to the integration and the known working nature of the SiP, designers will have a higher chance of first pass design success, reducing multiple spins of a design, reducing both time and money. The 1mm pitch spacing of the BGA, enables the use of one of the lowest cost design rules available, significantly reducing the cost of a PCB. Further savings are provided by SiP through removing PCB Layers. A typical design with DDR3 requires at least a 6 layer PCB to properly route the DDR to microprocessor high speed interfaces. Since this connection is done internal to the SiP the designer can reduce the number of layers needed. This can be seen in all of the OSD32MP1 references designs which are only 4 layers. This reduction in layers as well as the over all area of the PCB provide significant savings to the designer. With the SiP replacing over 100 components, assembly and supply chain management is simplified. Finally, Octavo Systems is committed to supporting products as long as possible. With a business supporting industrial customers that have 10 year lifetime requirements, Octavo Systems manages the individual device EOL and has processes in place to help alleviate it. Over the lifetime of the product, using a SiP provides significant reduction in the total cost of ownership compared to some of the other methods to implement for a system.