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next gen
Today’s semiconductor industry demands that RF limiters are able to handle higher power, and, in a small surface mount package. In the proper operation of semiconductor devices, minimizing the junction temperature is critical to reliability and performance. In order to limit the junction temperature to absolute maximum limits, the maximum input power can be reduced or the environmental conditions are altered to lower the overall temperature of the device. Where power requirements are fixed, the only option is the latter. This can be achieved by either cooling the device by extravagant and expensive methods or optimizing the thermal management of the package. MACOM’s recent additions to their portfolio of power limiters support these demands, providing solutions for receiver protection circuits in high power radar applications.
PTM Published on: 2015-05-11