Heat Sinks

Results: 14
Manufacturer
Assmann WSW ComponentsCUI DevicesMalico Inc.OhmiteSeeed Technology Co., LtdSparkFun Electronicst-Global TechnologyWatterott Electronic GmbH
Series
-BGHSBHSSMBHTGH
Packaging
BagBoxBulkTray
Product Status
ActiveDiscontinued at Digi-Key
Type
Board LevelTop MountTop Mount Kit
Package Cooled
6-Dip and 8-Dip-Allegro A4983Assorted (BGA, LGA, CPU, ASIC...)BGABGA, CPU, GPURaspberry Pi B+Stepper Motor Driver BoardTO-220
Attachment Method
-AdhesiveAdhesive (Not Included)Bolt OnClip, Thermal Tape, Adhesive (Not included)Press FitThermal Tape, Adhesive (Included)Thermal Tape, Adhesive (Not Included)
Shape
Rectangular, FinsSquare, Angled FinsSquare, FinsSquare, Pin Fins
Length
0.250" (6.35mm)0.295" (7.50mm)0.334" (8.50mm)0.335" (8.50mm)0.354" (9.00mm)0.394" (10.00mm)0.551" (14.00mm)0.591" (15.00mm)0.669" (17.00mm)0.709" (18.00mm)0.748" (19.00mm)1.319" (33.50mm)-
Width
0.190" (4.83mm)0.250" (6.35mm)0.295" (7.50mm)0.335" (8.50mm)0.354" (9.00mm)0.394" (10.00mm)0.551" (14.00mm)0.591" (15.00mm)0.669" (17.00mm)0.709" (18.00mm)0.748" (19.00mm)1.319" (33.50mm)-
Fin Height
0.189" (4.80mm)0.236" (6.00mm)0.275" (7.00mm)0.295" (7.50mm)0.300" (7.62mm)0.315" (8.00mm)0.375" (9.52mm)0.394" (10.00mm)0.472" (12.00mm)-
Power Dissipation @ Temperature Rise
2.0W @ 75°C2.1W @ 75°C2.5W @ 75°C2.9W @ 75°C3.2W @ 75°C4.94W @ 75°C-
Thermal Resistance @ Forced Air Flow
5.30°C/W @ 200 LFM7.51°C/W @ 200 LFM13.10°C/W @ 200 LFM15.80°C/W @ 200 LFM16.50°C/W @ 200 LFM18.80°C/W @ 200 LFM-
Thermal Resistance @ Natural
15.19°C/W18.00°C/W23.68°C/W26.32°C/W29.73°C/W32.00°C/W35.98°C/W37.90°C/W80.00°C/W-
Material
-AluminumAluminum AlloyCopper
Material Finish
-Black AnodizedClean Anodized
Stocking Options
Environmental Options
Media
Marketplace Product
14Results
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
27,220
In Stock
11,000
Factory
1 : ¥3.86000
Bulk
-
Bulk
Active
Top Mount
6-Dip and 8-Dip
Press Fit
Rectangular, Fins
0.334" (8.50mm)
0.250" (6.35mm)
-
0.189" (4.80mm)
-
-
80.00°C/W
Aluminum
Black Anodized
TGH-0075-01
TGH-0075-01
ALUMINIUM HEAT SINK 7.5X7.5MM
t-Global Technology
154
In Stock
1 : ¥15.27000
Bulk
Bulk
Active
Top Mount
-
-
Square, Fins
0.295" (7.50mm)
0.295" (7.50mm)
-
0.394" (10.00mm)
-
-
-
Aluminum
Clean Anodized
30,365
In Stock
4,800
Factory
1 : ¥3.20000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.335" (8.50mm)
0.335" (8.50mm)
-
0.315" (8.00mm)
-
-
32.00°C/W
Aluminum Alloy
Black Anodized
HSB02-101007
HSB02-101007
HEAT SINK, BGA, 10 X 10 X 7 MM
CUI Devices
5,523
In Stock
1 : ¥5.50000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.394" (10.00mm)
0.394" (10.00mm)
-
0.275" (7.00mm)
2.0W @ 75°C
16.50°C/W @ 200 LFM
37.90°C/W
Aluminum Alloy
Black Anodized
HSB03-141406
HSB03-141406
HEAT SINK, BGA, 14 X 14 X 6 MM
CUI Devices
1,934
In Stock
1 : ¥6.08000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.551" (14.00mm)
0.551" (14.00mm)
-
0.236" (6.00mm)
2.1W @ 75°C
15.80°C/W @ 200 LFM
35.98°C/W
Aluminum Alloy
Black Anodized
HSB04-171706
HSB04-171706
HEAT SINK, BGA, 17 X 17 X 6 MM
CUI Devices
1,642
In Stock
1 : ¥6.65000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.236" (6.00mm)
2.5W @ 75°C
13.10°C/W @ 200 LFM
29.73°C/W
Aluminum Alloy
Black Anodized
114990125
114990125
HEAT SINK KIT FOR RASPBERRY PI
Seeed Technology Co., Ltd
3,624
In Stock
1 : ¥8.13000
Bulk
-
Bulk
Active
Top Mount Kit
Raspberry Pi B+
Adhesive
Square, Fins
-
-
-
-
-
-
-
Aluminum
-
HSB06-181810
HSB06-181810
HEAT SINK, BGA, 18 X 18 X 10 MM
CUI Devices
1,820
In Stock
1 : ¥8.37000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.709" (18.00mm)
0.709" (18.00mm)
-
0.394" (10.00mm)
3.2W @ 75°C
18.80°C/W @ 200 LFM
23.68°C/W
Aluminum Alloy
Black Anodized
HSB26-343408
HSB26-343408
HEAT SINK, BGA, 33.5 X 33.5 X 8
CUI Devices
750
In Stock
1 : ¥9.36000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
1.319" (33.50mm)
1.319" (33.50mm)
-
0.315" (8.00mm)
4.94W @ 75°C
5.30°C/W @ 200 LFM
15.19°C/W
Aluminum Alloy
Black Anodized
BG-Series-3
BGAH150-075E
BGA HEATSINK W/TAPE
Ohmite
141
In Stock
1 : ¥46.96000
Box
Box
Active
Top Mount
BGA, CPU, GPU
Thermal Tape, Adhesive (Included)
Square, Angled Fins
0.591" (15.00mm)
0.591" (15.00mm)
-
0.295" (7.50mm)
-
-
18.00°C/W
Aluminum Alloy
Black Anodized
MBH10002-14P/CU/2
MBH10002-14P/CU/2
CU HEAT SINK 10X10X14MM WITH PIN
Malico Inc.
476
In Stock
1 : ¥39.41000
Tray
Tray
Active
Top Mount
BGA
Clip, Thermal Tape, Adhesive (Not included)
Square, Pin Fins
0.394" (10.00mm)
0.394" (10.00mm)
-
0.472" (12.00mm)
-
-
-
Copper
-
HSS-B20-NP-06
HSS-B20-NP-06
HEATSINK TO-220 2.9W ALUMINUM
CUI Devices
894
In Stock
1 : ¥2.96000
Bag
Bag
Active
Board Level
TO-220
Bolt On
Square, Fins
0.748" (19.00mm)
0.748" (19.00mm)
-
0.375" (9.52mm)
2.9W @ 75°C
7.51°C/W @ 200 LFM
26.32°C/W
Aluminum
Black Anodized
20188
20188
SILENTSTEPSTICK HEATSINK 9 X 9 X
Watterott Electronic GmbH
0
In Stock
Check Lead Time
1 : ¥7.64000
Bulk
-
Bulk
Active
Top Mount
Stepper Motor Driver Board
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.354" (9.00mm)
0.354" (9.00mm)
-
0.472" (12.00mm)
-
-
-
Aluminum
Black Anodized
0
In Stock
1 : ¥17.24000
Bulk
-
Bulk
Discontinued at Digi-Key
Top Mount
Allegro A4983
-
Rectangular, Fins
0.250" (6.35mm)
0.190" (4.83mm)
-
0.300" (7.62mm)
-
-
-
-
Black Anodized
Showing
of 14

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.