Heat Sinks

Results: 17
Manufacturer
Advanced Thermal Solutions Inc.Boyd Laconia, LLCSeeed Technology Co., Ltdt-Global TechnologyWakefield-Vette
Series
-518528567maxiFLOWPenguinpushPIN™TGH
Packaging
BulkTray
Type
Board LevelTop MountTop Mount Kit
Package Cooled
-Assorted (BGA, LGA, CPU, ASIC...)BGAEighth Brick DC/DC ConverterHalf Brick DC/DC ConverterRaspberry Pi 4BTO-220
Attachment Method
-AdhesiveBolt OnBolt On, Thermal MaterialPush PinThermal Tape, Adhesive (Included)
Shape
-Rectangular, Angled FinsRectangular, FinsSquare, FinsSquare, Pin Fins
Length
0.591" (15.00mm)0.650" (16.51mm)0.750" (19.05mm)0.787" (20.00mm)0.866" (22.00mm)1.732" (44.00mm)1.969" (50.00mm)2.165" (55.00mm)2.283" (58.00mm)2.402" (61.00mm)2.756" (70.00mm)3.071" (78.00mm)3.937" (100.00mm)-
Width
0.547" (13.89mm)0.591" (15.00mm)0.653" (16.59mm)0.750" (19.05mm)0.787" (20.00mm)0.815" (20.70mm)0.866" (22.00mm)0.906" (23.00mm)1.417" (36.00mm)2.008" (51.00mm)2.165" (55.00mm)2.280" (57.91mm)2.756" (70.00mm)-
Fin Height
0.236" (6.00mm)0.240" (6.10mm)0.350" (8.89mm)0.354" (9.00mm)0.374" (9.50mm)0.380" (9.65mm)0.449" (11.40mm)0.450" (11.43mm)0.787" (19.99mm)0.950" (24.13mm)0.984" (25.00mm)1.106" (28.09mm)1.402" (35.60mm)-
Power Dissipation @ Temperature Rise
2.5W @ 60°C7.0W @ 60°C11.0W @ 60°C-
Thermal Resistance @ Forced Air Flow
2.00°C/W @ 300 LFM2.18°C/W @ 100 LFM2.20°C/W @ 200 LFM3.00°C/W @ 200 LFM3.20°C/W @ 300 LFM7.20°C/W @ 300 LFM7.30°C/W @ 200 LFM8.00°C/W @ 500 LFM8.50°C/W @ 200 LFM10.00°C/W @ 200 LFM29.50°C/W @ 200 LFM-
Thermal Resistance @ Natural
7.20°C/W24.00°C/W-
Material
-Aluminum
Material Finish
-Black AnodizedBlue AnodizedClean AnodizedGold AnodizedUnfinished
Stocking Options
Environmental Options
Media
Marketplace Product
17Results
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
110991327
110991327
HEAT SINK KIT FOR RASPBERRY PI 4
Seeed Technology Co., Ltd
28,079
In Stock
1 : ¥8.13000
Bulk
-
Bulk
Active
Top Mount Kit
Raspberry Pi 4B
Adhesive
-
-
-
-
-
-
-
-
Aluminum
-
507302B00000G
507302B00000G
HEATSINK TO-220 2.5W LOW PROFILE
Boyd Laconia, LLC
1,415
In Stock
1 : ¥8.13000
Bulk
-
Bulk
Active
Board Level
TO-220
Bolt On
Square, Fins
0.750" (19.05mm)
0.750" (19.05mm)
-
0.380" (9.65mm)
2.5W @ 60°C
10.00°C/W @ 200 LFM
24.00°C/W
Aluminum
Black Anodized
LTN20069-T5
LTN20069
HEAT SINK BGA/PGA 16.5X16.5X8.9
Wakefield-Vette
11,986
In Stock
1 : ¥16.83000
Bulk
Bulk
Active
Board Level
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Fins
0.650" (16.51mm)
0.653" (16.59mm)
-
0.350" (8.89mm)
-
8.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
1,565
In Stock
1 : ¥50.73000
Bulk
-
Bulk
Active
Top Mount
-
Bolt On
Rectangular, Fins
1.969" (50.00mm)
0.547" (13.89mm)
-
0.984" (25.00mm)
-
8.50°C/W @ 200 LFM
-
Aluminum
Black Anodized
518-95AB
518-95AB
HEATSINK DC/DC HALF BRICK VERT
Wakefield-Vette
4,069
In Stock
1 : ¥56.32000
Bulk
Bulk
Active
Board Level
Half Brick DC/DC Converter
Bolt On
Rectangular, Fins
2.402" (61.00mm)
2.280" (57.91mm)
-
0.950" (24.13mm)
11.0W @ 60°C
2.00°C/W @ 300 LFM
-
Aluminum
Black Anodized
1,125
In Stock
1 : ¥57.55000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Fins
0.591" (15.00mm)
0.591" (15.00mm)
-
0.374" (9.50mm)
-
29.50°C/W @ 200 LFM
-
Aluminum
Black Anodized
139
In Stock
1 : ¥59.68000
Bulk
-
Bulk
Active
Top Mount
-
Bolt On
Rectangular, Fins
3.071" (78.00mm)
1.417" (36.00mm)
-
1.106" (28.09mm)
-
3.00°C/W @ 200 LFM
-
Aluminum
Black Anodized
1,213
In Stock
1 : ¥69.78000
Bulk
-
Bulk
Active
Top Mount
-
Bolt On
Rectangular, Fins
3.071" (78.00mm)
1.417" (36.00mm)
-
1.402" (35.60mm)
-
2.20°C/W @ 200 LFM
-
Aluminum
Black Anodized
ATS-1179-C1-R0
ATS-1179-C1-R0
1/8 BRICK HEATSINK 58X23X11.4MM
Advanced Thermal Solutions Inc.
1,835
In Stock
1 : ¥86.36000
Bulk
Bulk
Active
Top Mount
Eighth Brick DC/DC Converter
Bolt On
Rectangular, Angled Fins
2.283" (58.00mm)
0.906" (23.00mm)
-
0.449" (11.40mm)
-
7.30°C/W @ 200 LFM
-
Aluminum
Gold Anodized
TGH-0200-06
TGH-0200-06
ALUMINIUM HEAT SINK 44X20MM
t-Global Technology
972
In Stock
1 : ¥17.73000
Bulk
Bulk
Active
Top Mount
-
-
Rectangular, Fins
1.732" (44.00mm)
0.787" (20.00mm)
-
0.236" (6.00mm)
-
-
-
Aluminum
Clean Anodized
TGH-0200-03
TGH-0200-03
ALUMINIUM HEAT SINK 20X20MM
t-Global Technology
113
In Stock
1 : ¥17.73000
Bulk
Bulk
Active
Top Mount
-
-
Square, Pin Fins
0.787" (20.00mm)
0.787" (20.00mm)
-
0.374" (9.50mm)
-
-
-
Aluminum
-
TGH-0220-03
TGH-0220-03
ALUMINIUM HEAT SINK 22X22MM
t-Global Technology
700
In Stock
1 : ¥19.29000
Bulk
Bulk
Active
Top Mount
-
-
Square, Pin Fins
0.866" (22.00mm)
0.866" (22.00mm)
-
0.354" (9.00mm)
-
-
-
Aluminum
Black Anodized
567-24AB
567-24AB
1/8 BRICK HEATSINK 55X20.7X6.1MM
Wakefield-Vette
303
In Stock
1 : ¥38.91000
Tray
Tray
Active
Top Mount
Eighth Brick DC/DC Converter
Bolt On, Thermal Material
Rectangular, Fins
2.165" (55.00mm)
0.815" (20.70mm)
-
0.240" (6.10mm)
-
7.20°C/W @ 300 LFM
7.20°C/W
-
Unfinished
TGH-0510-02
TGH-0510-02
ALUMINIUM HEAT SINK 100X51MM
t-Global Technology
586
In Stock
1 : ¥75.28000
Bulk
Bulk
Active
Top Mount
-
-
Rectangular, Fins
3.937" (100.00mm)
2.008" (51.00mm)
-
0.787" (19.99mm)
-
-
-
Aluminum
-
TGH-0550-01
TGH-0550-01
ALUMINIUM HEAT SINK 55X55MM
t-Global Technology
731
In Stock
1 : ¥53.28000
Bulk
Bulk
Active
Top Mount
-
-
Square, Fins
2.165" (55.00mm)
2.165" (55.00mm)
-
0.236" (6.00mm)
-
-
-
Aluminum
-
528-45AB
528-45AB
HEATSINK DC/DC HALF BRICK VERT
Wakefield-Vette
0
In Stock
Check Lead Time
1 : ¥39.08000
Bulk
Bulk
Active
Board Level
Half Brick DC/DC Converter
Bolt On
Rectangular, Fins
2.402" (61.00mm)
2.280" (57.91mm)
-
0.450" (11.43mm)
7.0W @ 60°C
3.20°C/W @ 300 LFM
-
Aluminum
Black Anodized
0
In Stock
Check Lead Time
1 : ¥87.43000
Bulk
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
2.756" (70.00mm)
2.756" (70.00mm)
-
0.984" (25.00mm)
-
2.18°C/W @ 100 LFM
-
Aluminum
Blue Anodized
Showing
of 17

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.