The first generation eMMC product is JEDEC eMMC version 5.0 compliant and is fully compatible with previous eMMC standards. It uses 15 nm MLC NAND Flash for cost-effective and higher storage solution in embedded applications. A wide range of density is offered – all the way from 4 GB to 64 GB, while the 128 GB will be available late 2018. The maximum interface bandwidth supported is 400 MByte/s, since it can run Dual Data Rate at 200 MHz in a by 8 IO configuration. Host processor can select by 1 or by 4 or a by 8 IO configuration as well. Two industry standard package options are offered - one is a 153 ball BGA package and the other is a 100 ball BGA package. The eMMC device supports industrial temperature which is -40oC to 85oC, and all the eMMC devices are Automotive grade qualified, in other words they are all AEC-Q100 certified.