This slide illustrates a typical electronic thermal situation. At the center is an integrated circuit, which generates heat and must be kept cool. A TIM1 material is used to dissipate heat from the IC to the package lid. TIM1 materials are silicone gels used in the Semiconductor industry. This discussion will focus on TIM2 materials, which are used to draw heat away from the semiconductor package into a heat sink for cooling. Semiconductor materials refer to any materials used to build the semiconductor package, whereas assembly materials are any materials used outside the package.