Heat Sinks

Results: 14
Manufacturer
Boyd Laconia, LLCCUI DevicesOhmiteWakefield-Vette
Series
-567678C40HSEPenguinRR2VM
Packaging
BagBoxBulk
Type
Board LevelBoard Level, VerticalTop Mount
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)Eighth Brick DC/DC ConverterTO-218, TO-220, TO-247TO-220TO-220, TO-218TO-220, TO-247TO-247TO-247, TO-264, SOT-227
Attachment Method
Bolt On and Board MountsBolt On and PC PinBolt On, Thermal MaterialClip and Board MountsClip and PC PinSolderable FeetThermal Tape, Adhesive (Included)
Shape
Rectangular, FinsSquare, Fins
Length
0.650" (16.51mm)1.000" (25.40mm)1.500" (38.10mm)1.520" (38.61mm)1.654" (42.00mm)1.950" (49.53mm)2.000" (50.80mm)2.165" (55.00mm)2.283" (58.00mm)2.362" (60.00mm)
Width
0.653" (16.59mm)0.815" (20.70mm)0.984" (25.00mm)0.985" (25.00mm)1.260" (32.00mm)1.375" (34.93mm)1.380" (35.05mm)1.650" (41.91mm)1.724" (43.79mm)1.900" (48.26mm)2.362" (60.00mm)
Fin Height
0.350" (8.89mm)0.449" (11.40mm)0.500" (12.70mm)0.551" (14.00mm)0.870" (22.10mm)0.950" (24.13mm)0.984" (25.00mm)1.000" (25.40mm)1.260" (32.00mm)1.500" (38.10mm)1.520" (38.61mm)2.000" (50.80mm)2.500" (63.50mm)
Power Dissipation @ Temperature Rise
2.0W @ 20°C3.0W @ 20°C4.0W @ 20°C4.0W @ 30°C5.7W @ 75°C8.0W @ 40°C8.0W @ 80°C10.0W @ 50°C14.0W @ 70°C-
Thermal Resistance @ Forced Air Flow
0.60°C/W @ 600 LFM1.00°C/W @ 200 LFM1.00°C/W @ 300 LFM1.00°C/W @ 400 LFM1.00°C/W @ 800 LFM1.50°C/W @ 600 LFM2.00°C/W @ 300 LFM2.50°C/W @ 400 LFM3.00°C/W @ 500 LFM4.30°C/W @ 300 LFM7.74°C/W @ 200 LFM8.00°C/W @ 500 LFM-
Thermal Resistance @ Natural
3.10°C/W3.50°C/W3.90°C/W4.30°C/W4.40°C/W4.80°C/W5.60°C/W8.60°C/W11.00°C/W13.16°C/W-
Material
-AluminumAluminum Alloy
Material Finish
Black AnodizedDegreasedUnfinished
Stocking Options
Environmental Options
Media
Marketplace Product
14Results

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
513102B02500(G)
513102B02500G
HEATSINK TO-220 W/PINS 1.5"TALL
Boyd Laconia, LLC
14,542
In Stock
1 : ¥11.58000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.500" (38.10mm)
1.375" (34.93mm)
-
0.500" (12.70mm)
8.0W @ 80°C
3.00°C/W @ 500 LFM
11.00°C/W
Aluminum
Black Anodized
LTN20069-T5
LTN20069
HEAT SINK BGA/PGA 16.5X16.5X8.9
Wakefield-Vette
11,998
In Stock
1 : ¥16.83000
Bulk
Bulk
Active
Board Level
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Fins
0.650" (16.51mm)
0.653" (16.59mm)
-
0.350" (8.89mm)
-
8.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
6396BG
6396BG
HEATSINK TO-218/TO-220 PIN
Boyd Laconia, LLC
2,397
In Stock
1 : ¥17.49000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220, TO-218
Bolt On and PC Pin
Rectangular, Fins
1.000" (25.40mm)
1.650" (41.91mm)
-
1.000" (25.40mm)
4.0W @ 30°C
1.50°C/W @ 600 LFM
5.60°C/W
Aluminum
Black Anodized
RA-T2X-38E
RA-T2X-38E
HEATSINK TO-220,TO-218,TO-247
Ohmite
1,557
In Stock
1 : ¥22.08000
Box
Box
Active
Board Level, Vertical
TO-218, TO-220, TO-247
Bolt On and PC Pin
Rectangular, Fins
1.654" (42.00mm)
0.985" (25.00mm)
-
1.500" (38.10mm)
14.0W @ 70°C
1.00°C/W @ 400 LFM
3.90°C/W
Aluminum
Black Anodized
R2A-CT4-38E
R2A-CT4-38E
HEATSINK FOR TO-247
Ohmite
3,389
In Stock
1 : ¥26.03000
Box
Box
Active
Board Level
TO-247
Clip and PC Pin
Rectangular, Fins
1.500" (38.10mm)
1.380" (35.05mm)
-
0.870" (22.10mm)
2.0W @ 20°C
1.00°C/W @ 800 LFM
8.60°C/W
Aluminum
Black Anodized
RA-T2X-64E
RA-T2X-64E
HEATSINK TO-218,TO-220,TO-247
Ohmite
588
In Stock
1 : ¥32.35000
Box
Box
Active
Board Level, Vertical
TO-218, TO-220, TO-247
Bolt On and PC Pin
Rectangular, Fins
1.654" (42.00mm)
0.985" (25.00mm)
-
2.500" (63.50mm)
4.0W @ 20°C
1.00°C/W @ 200 LFM
3.10°C/W
Aluminum
Black Anodized
C40-058-VE
C40-058-VE
HEATSINK FOR TO-247 TO-264
Ohmite
804
In Stock
1 : ¥36.04000
Box
Box
Active
Board Level, Vertical
TO-247, TO-264, SOT-227
Clip and Board Mounts
Rectangular, Fins
2.283" (58.00mm)
1.724" (43.79mm)
-
1.260" (32.00mm)
-
-
-
Aluminum
Degreased
HSE-BX-040H
HSE-B20254-040H
HEAT SINK, EXTRUSION, TO-220, 25
CUI Devices
3,575
In Stock
1 : ¥9.19000
Bag
Bag
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.000" (25.40mm)
1.260" (32.00mm)
-
0.551" (14.00mm)
5.7W @ 75°C
7.74°C/W @ 200 LFM
13.16°C/W
Aluminum Alloy
Black Anodized
7023b-mtg
7023B-MTG
BOARD LEVEL HEATSINK 1.95" TO220
Boyd Laconia, LLC
2,606
In Stock
1 : ¥13.87000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.950" (49.53mm)
1.900" (48.26mm)
-
0.950" (24.13mm)
3.0W @ 20°C
2.50°C/W @ 400 LFM
4.40°C/W
Aluminum
Black Anodized
RA-T2X-51E
RA-T2X-51E
HEATSINK TO-218,TO-220,TO-247
Ohmite
1,669
In Stock
1 : ¥20.20000
Box
Box
Active
Board Level, Vertical
TO-218, TO-220, TO-247
Bolt On and PC Pin
Rectangular, Fins
1.654" (42.00mm)
0.985" (25.00mm)
-
2.000" (50.80mm)
8.0W @ 40°C
1.00°C/W @ 300 LFM
3.50°C/W
Aluminum
Black Anodized
567-45AB
567-45AB
1/8 BRICK HEATSINK 55X20.7X11.4M
Wakefield-Vette
1,175
In Stock
1 : ¥39.90000
Bulk
Bulk
Active
Top Mount
Eighth Brick DC/DC Converter
Bolt On, Thermal Material
Rectangular, Fins
2.165" (55.00mm)
0.815" (20.70mm)
-
0.449" (11.40mm)
-
4.30°C/W @ 300 LFM
4.30°C/W
-
Unfinished
532702B02500G
532702B02500G
HEATSINK TO-220 SOLDERPIN 50.8MM
Boyd Laconia, LLC
812
In Stock
1 : ¥46.39000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
2.000" (50.80mm)
1.650" (41.91mm)
-
1.000" (25.40mm)
10.0W @ 50°C
2.00°C/W @ 300 LFM
4.80°C/W
Aluminum
Black Anodized
678-39
678-39-S
HEATSINK TO-220/TO-247 SCREW
Wakefield-Vette
1,715
In Stock
1 : ¥59.85000
Box
Box
Active
Board Level, Vertical
Assorted (BGA, LGA, CPU, ASIC...)
Bolt On and Board Mounts
Rectangular, Fins
2.362" (60.00mm)
0.984" (25.00mm)
-
1.520" (38.61mm)
-
0.60°C/W @ 600 LFM
-
Aluminum
Black Anodized
VM SERIES
VM2-038-1AE
HEATSINK HORIZONTAL
Ohmite
90
In Stock
1 : ¥42.36000
Bulk
Bulk
Active
Board Level
TO-220, TO-247
Solderable Feet
Rectangular, Fins
1.520" (38.61mm)
2.362" (60.00mm)
-
0.984" (25.00mm)
10.0W @ 50°C
0.60°C/W @ 600 LFM
-
Aluminum
Black Anodized
Showing
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Heat Sinks


Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.