Heat Sinks

Results: 13
Manufacturer
Advanced Thermal Solutions Inc.Assmann WSW ComponentsBoyd Laconia, LLCCUI DevicesDFRobotSeeed Technology Co., Ltdt-Global TechnologyWakefield-VetteWatterott Electronic GmbH
Series
-2585731HSBHSSTGH
Packaging
BoxBulkCut Tape (CT)Digi-Reel®Tape & Reel (TR)
Type
Board LevelBoard Level, VerticalTop MountTop Mount Kit
Package Cooled
6-Dip and 8-Dip-Assorted (BGA, LGA, CPU, ASIC...)BGARaspberry PiRaspberry Pi 4BStepper Motor Driver BoardStud Mounted DiodeTO-220TO-252 (DPak)TO-263 (D²Pak)
Attachment Method
-AdhesiveAdhesive (Not Included)PC PinPress FitSMD PadThermal Tape, Adhesive (Included)Thermal Tape, Adhesive (Not Included)Type 120 Compound
Shape
-RectangularRectangular, Angled FinsRectangular, FinsSquare, Pin Fins
Length
0.211" (5.35mm)0.250" (6.35mm)0.315" (8.00mm)0.320" (8.13mm)0.334" (8.50mm)0.335" (8.50mm)0.354" (9.00mm)0.394" (10.00mm)0.500" (12.70mm)0.520" (13.20mm)1.299" (33.00mm)-
Width
0.250" (6.35mm)0.335" (8.50mm)0.354" (9.00mm)0.394" (10.00mm)0.476" (12.10mm)0.500" (12.70mm)0.787" (20.00mm)0.790" (20.07mm)0.874" (22.20mm)0.900" (22.86mm)1.031" (26.20mm)-
Fin Height
0.189" (4.80mm)0.275" (7.00mm)0.315" (8.00mm)0.340" (8.64mm)0.374" (9.50mm)0.390" (9.91mm)0.400" (10.16mm)0.402" (10.21mm)0.472" (12.00mm)1.250" (31.75mm)-
Power Dissipation @ Temperature Rise
0.8W @ 30°C2.0W @ 75°C2.9W @ 75°C-
Thermal Resistance @ Forced Air Flow
8.18°C/W @ 200 LFM9.50°C/W @ 200 LFM12.50°C/W @ 600 LFM16.50°C/W @ 200 LFM-
Thermal Resistance @ Natural
12.00°C/W18.00°C/W25.00°C/W26.00°C/W26.13°C/W31.00°C/W32.00°C/W37.90°C/W80.00°C/W-
Material
AluminumAluminum AlloyCopper
Material Finish
-Black AnodizedTin
Stocking Options
Environmental Options
Media
Marketplace Product
13Results
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of 13
Compare
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
27,061
In Stock
11,000
Factory
1 : ¥3.86000
Bulk
-
Bulk
Active
Top Mount
6-Dip and 8-Dip
Press Fit
Rectangular, Fins
0.334" (8.50mm)
0.250" (6.35mm)
-
0.189" (4.80mm)
-
-
80.00°C/W
Aluminum
Black Anodized
V2017B
V2017B
HEATSINK ANOD ALUM CPU
Assmann WSW Components
6,055
In Stock
1 : ¥4.52000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
-
Square, Pin Fins
0.394" (10.00mm)
0.394" (10.00mm)
-
0.275" (7.00mm)
-
-
31.00°C/W
Aluminum
Black Anodized
110991327
110991327
HEAT SINK KIT FOR RASPBERRY PI 4
Seeed Technology Co., Ltd
28,097
In Stock
1 : ¥8.13000
Bulk
-
Bulk
Active
Top Mount Kit
Raspberry Pi 4B
Adhesive
-
-
-
-
-
-
-
-
Aluminum
-
573100D00010G
573100D00010G
HEATSINK SMT D-PAK/TO-252 TIN
Boyd Laconia, LLC
8,655
In Stock
1 : ¥10.75000
Cut Tape (CT)
250 : ¥8.60980
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.315" (8.00mm)
0.900" (22.86mm)
-
0.400" (10.16mm)
0.8W @ 30°C
12.50°C/W @ 600 LFM
26.00°C/W
Aluminum
Tin
29,198
In Stock
4,800
Factory
1 : ¥3.20000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.335" (8.50mm)
0.335" (8.50mm)
-
0.315" (8.00mm)
-
-
32.00°C/W
Aluminum Alloy
Black Anodized
HSB02-101007
HSB02-101007
HEAT SINK, BGA, 10 X 10 X 7 MM
CUI Devices
5,450
In Stock
1 : ¥5.50000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.394" (10.00mm)
0.394" (10.00mm)
-
0.275" (7.00mm)
2.0W @ 75°C
16.50°C/W @ 200 LFM
37.90°C/W
Aluminum Alloy
Black Anodized
116,730
In Stock
1 : ¥6.73000
Bulk
-
Bulk
Active
Top Mount
TO-263 (D²Pak)
-
Rectangular, Fins
0.500" (12.70mm)
1.031" (26.20mm)
-
0.402" (10.21mm)
-
9.50°C/W @ 200 LFM
18.00°C/W
Copper
Tin
TGH-0200-05
TGH-0200-05
ALUMINIUM HEAT SINK 33X20MM
t-Global Technology
636
In Stock
1 : ¥17.73000
Bulk
Bulk
Active
Top Mount
-
-
Rectangular, Fins
1.299" (33.00mm)
0.787" (20.00mm)
-
0.374" (9.50mm)
-
-
-
Aluminum
Black Anodized
FIT0367
FIT0367
RASPBERRY PI COPPER HEATSINK
DFRobot
107
In Stock
1 : ¥8.13000
Bulk
-
Bulk
Active
Top Mount
Raspberry Pi
Thermal Tape, Adhesive (Included)
Rectangular
0.520" (13.20mm)
0.476" (12.10mm)
-
-
-
-
-
Copper
-
258
258
.5X.25X.34 HEATSINK FOR DIODE
Wakefield-Vette
98
In Stock
1 : ¥223.14000
Bulk
Bulk
Active
Board Level
Stud Mounted Diode
Type 120 Compound
Rectangular
0.250" (6.35mm)
0.500" (12.70mm)
-
0.340" (8.64mm)
-
-
12.00°C/W
Aluminum
-
V-1100-SMD/B-L
V-1100-SMD/B-L
HEAT SINK COPPER DPAK TO-252
Assmann WSW Components
0
In Stock
Check Lead Time
1 : ¥4.10000
Bulk
-
Bulk
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.320" (8.13mm)
0.790" (20.07mm)
-
0.390" (9.91mm)
-
-
25.00°C/W
Copper
Tin
20188
20188
SILENTSTEPSTICK HEATSINK 9 X 9 X
Watterott Electronic GmbH
0
In Stock
Check Lead Time
1 : ¥7.64000
Bulk
-
Bulk
Active
Top Mount
Stepper Motor Driver Board
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.354" (9.00mm)
0.354" (9.00mm)
-
0.472" (12.00mm)
-
-
-
Aluminum
Black Anodized
HSS-B20-043H-01
HSS-B20-043H-01
HEATSINK TO-220 2.9W ALUMINUM
CUI Devices
0
In Stock
Check Lead Time
1,000 : ¥3.60698
Box
Box
Active
Board Level, Vertical
TO-220
PC Pin
Rectangular, Angled Fins
0.211" (5.35mm)
0.874" (22.20mm)
-
1.250" (31.75mm)
2.9W @ 75°C
8.18°C/W @ 200 LFM
26.13°C/W
Aluminum
Black Anodized
Showing
of 13

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.