Heat Sinks

Results: 13
Manufacturer
Advanced Thermal Solutions Inc.Assmann WSW ComponentsBoyd Laconia, LLCCUI Devicest-Global TechnologyWakefield-Vette
Series
-625634HSSmaxiFLOWTGH
Packaging
BagBoxBulk
Type
Board LevelBoard Level, VerticalTop MountTop Mount, Extrusion
Package Cooled
6-Dip and 8-Dip14-DIP and 16-DIP20-DIP24-DIP-Assorted (BGA, LGA, CPU, ASIC...)BGAEighth Brick DC/DC ConverterTO-220
Attachment Method
-AdhesiveBolt OnBolt On and PC PinPress FitPress Fit, Slide OnThermal Tape, Adhesive (Included)Thermal Tape, Adhesive (Not Included)
Shape
Rectangular, Angled FinsRectangular, FinsSquare, Pin Fins
Length
0.250" (6.35mm)0.334" (8.50mm)0.984" (25.00mm)1.055" (26.80mm)1.063" (27.00mm)1.299" (32.99mm)1.378" (35.00mm)1.500" (38.10mm)2.000" (50.80mm)2.283" (58.00mm)11.811" (300.00mm)
Width
0.250" (6.35mm)0.472" (12.00mm)0.504" (12.80mm)0.512" (13.00mm)0.551" (14.00mm)0.640" (16.26mm)0.700" (17.78mm)0.748" (19.00mm)0.906" (23.00mm)0.984" (25.00mm)1.063" (27.00mm)
Fin Height
0.189" (4.80mm)0.190" (4.83mm)0.236" (6.00mm)0.256" (6.50mm)0.350" (8.89mm)0.449" (11.40mm)0.500" (12.70mm)0.556" (14.12mm)0.630" (16.00mm)0.640" (16.26mm)
Power Dissipation @ Temperature Rise
2.0W @ 60°C3.0W @ 50°C4.0W @ 75°C-
Thermal Resistance @ Forced Air Flow
2.00°C/W @ 300 LFM5.01°C/W @ 200 LFM7.30°C/W @ 200 LFM11.00°C/W @ 200 LFM13.10°C/W @ 200 LFM20.00°C/W @ 200 LFM-
Thermal Resistance @ Natural
18.63°C/W20.00°C/W38.00°C/W39.00°C/W40.00°C/W48.00°C/W50.00°C/W80.00°C/W-
Material
AluminumAluminum Alloy
Material Finish
Black AnodizedDegreasedGold Anodized
Stocking Options
Environmental Options
Media
Marketplace Product
13Results
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of 13
Compare
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
26,750
In Stock
11,000
Factory
1 : ¥3.86000
Bulk
-
Bulk
Active
Top Mount
6-Dip and 8-Dip
Press Fit
Rectangular, Fins
0.334" (8.50mm)
0.250" (6.35mm)
-
0.189" (4.80mm)
-
-
80.00°C/W
Aluminum
Black Anodized
634-15ABPE
634-15ABPE
HEATSINK SLIM VERT BLACK TO-220
Wakefield-Vette
4,848
In Stock
1 : ¥24.71000
Box
Box
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.500" (38.10mm)
0.640" (16.26mm)
-
0.640" (16.26mm)
3.0W @ 50°C
2.00°C/W @ 300 LFM
50.00°C/W
Aluminum
Black Anodized
ATS-1179-C1-R0
ATS-1179-C1-R0
1/8 BRICK HEATSINK 58X23X11.4MM
Advanced Thermal Solutions Inc.
1,835
In Stock
1 : ¥86.37000
Bulk
Bulk
Active
Top Mount
Eighth Brick DC/DC Converter
Bolt On
Rectangular, Angled Fins
2.283" (58.00mm)
0.906" (23.00mm)
-
0.449" (11.40mm)
-
7.30°C/W @ 200 LFM
-
Aluminum
Gold Anodized
6,910
In Stock
1 : ¥2.96000
Bulk
-
Bulk
Active
Top Mount
14-DIP and 16-DIP
Press Fit
Rectangular, Fins
0.250" (6.35mm)
0.748" (19.00mm)
-
0.190" (4.83mm)
-
-
48.00°C/W
Aluminum
Black Anodized
2,628
In Stock
1,560
Factory
1 : ¥5.66000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
1.063" (27.00mm)
1.063" (27.00mm)
-
0.236" (6.00mm)
-
-
20.00°C/W
Aluminum Alloy
Black Anodized
1,503
In Stock
1 : ¥5.66000
Bulk
-
Bulk
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.984" (25.00mm)
0.472" (12.00mm)
-
0.256" (6.50mm)
-
-
40.00°C/W
Aluminum
Black Anodized
4,061
In Stock
1,500
Factory
1 : ¥7.80000
Bulk
-
Bulk
Active
Top Mount
24-DIP
Press Fit
Rectangular, Fins
1.299" (32.99mm)
0.748" (19.00mm)
-
0.189" (4.80mm)
-
-
48.00°C/W
Aluminum
Black Anodized
TGH-0130-03
TGH-0130-03
ALUMINIUM HEAT SINK 35X13MM
t-Global Technology
559
In Stock
1 : ¥11.82000
Bulk
Bulk
Active
Top Mount
-
-
Rectangular, Fins
1.378" (35.00mm)
0.512" (13.00mm)
-
0.236" (6.00mm)
-
-
-
Aluminum
Black Anodized
634-20ABPE
634-20ABPE
HEATSINK TO-220 VERT MT BLK 2"
Wakefield-Vette
49,907
In Stock
1 : ¥23.15000
Box
Box
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
2.000" (50.80mm)
0.640" (16.26mm)
-
0.640" (16.26mm)
-
-
-
Aluminum
Black Anodized
578
In Stock
1 : ¥102.38000
Bulk
-
Bulk
Active
Top Mount, Extrusion
-
Adhesive
Rectangular, Fins
11.811" (300.00mm)
0.551" (14.00mm)
-
0.630" (16.00mm)
-
11.00°C/W @ 200 LFM
38.00°C/W
Aluminum
Degreased
HSS-B20-NP
HSS-B20-NP
HEATSINK TO-220 4W ALUMINUM
CUI Devices
3,845
In Stock
1 : ¥6.24000
Box
Box
Active
Board Level
TO-220
-
Rectangular, Fins
1.500" (38.10mm)
0.504" (12.80mm)
-
0.500" (12.70mm)
4.0W @ 75°C
5.01°C/W @ 200 LFM
18.63°C/W
Aluminum
Black Anodized
HEATSINK FOR 25MM BGA
625-35AB
HEATSINK FOR 25MM BGA
Wakefield-Vette
392
In Stock
1 : ¥16.67000
Bulk
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.984" (25.00mm)
0.984" (25.00mm)
-
0.350" (8.89mm)
-
13.10°C/W @ 200 LFM
-
Aluminum
Black Anodized
HEATSINK 20-DIP BLK ANODIZED
580400B00000G
HEATSINK 20-DIP BLK ANODIZED
Boyd Laconia, LLC
0
In Stock
8,000 : ¥7.17540
Bag
-
Bag
Active
Top Mount
20-DIP
Press Fit, Slide On
Rectangular, Fins
1.055" (26.80mm)
0.700" (17.78mm)
-
0.556" (14.12mm)
2.0W @ 60°C
20.00°C/W @ 200 LFM
39.00°C/W
Aluminum
Black Anodized
Showing
of 13

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.