In switch mode power supply designs, a solid connection to the system ground is always needed. Power Block silicon sits on the ground node and it uses the ground layers of the PCB as an effective method to move heat away from the package. Traditional discrete FET solutions have the silicon sit on the Switch Node (Sync FET) and the Input Node (Control FET). The Sync FET typically dissipates two times the power over the Control FET so heat spreading is more important with the Sync FET. Unfortunately, the Switch Node is a very noisy node and is only used to connect between the Sync FET and the Control FET. As such, this node is not in abundance as is the ground node and is typically designed to be as small as possible. Customers can place vias underneath the FETs but the spreading effects will still be limited to the area of the FETs since the physical size of this copper node is limited to the area of the FETs due to noise concerns.