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NSP-25 Non-Silicone Putty Introduction Slide 9

This slide shows the value proposition for TG-NSP-25 and outlines the cost savings represented by the use of thermal putty compared to the more traditionally used materials. It is essential that the designer considers the total cost of ownership and not just the materials costs, because making an “apples to apples” comparison will not give the full economic picture.

PTM Published on: 2013-04-18