In summary, TG-NSP-25 is a one-part, fully cured, non-silicone thermal putty with a thermal conductivity of 2.5 W/mk. This thermal conductivity will allow it to address most of the common thermal issues that currently face the automotive industry. It has been specifically designed for the automotive industry and passes all the common thermal, mechanical, and environmental tests common to this market sector. TG-NSP-25 offers an exceptionally low total cost of ownership approach for the automotive industry. As TG-NSP-25 is a non-silicone product it will not out-gas. This is a distinct advantage when compared to silicone products commonly used in the automotive industry.