TG-NSP is thermal putty which does not require curing. It is provided as a pre-cured material that will reduce the processing time and cost, while offering greater design flexibility. The material is highly confirmable and can be dispensed using common dispensing equipment. It is also perfect for rework and repair. This is often a critical design consideration for the automotive industry. Not only does the material produce negligible stresses on components when compressed, it is non-silicone, reworkable, and passes all the standard automotive tests. It is for these reasons that the material has an exceptionally low total cost of ownership.