TG-NSP-25 is a non-silicone based formulation which is loaded with conductive, ceramic filler, and chemically cross-linked to form low modulus putty with a thermal conductivity of 2.5 w/mk. Like grease, this material provides low thermal impedance. However unlike grease, it will not pump out or undergo any physical or chemical changes under environmental cycling. The product, being electrically non-conductive, is designed for the automotive industry and for areas where stress on components generated must be kept to a minimum while maintaining excellent thermal transfer.