Going to a leadless package allows a larger die to fit inside the same footprint as a leaded package; therefore better performance can be achieved for the same footprint. As an alternative, a smaller solution can also be provided with the same electrical characteristics. NXP leadless packages are characterized over an extended temperature range of -40 to 125 degrees Celsius; typical devices only go up to 85 degree Celsius. This make them suitable for high stress environments, such as automotive and military applications. Reliability is also superior to WCSP and leaded packages, offering better adhesion to the PCB and being more impervious to chipping around the edges. These packages yield far less failures during assembly and the overall life of the end product. The leads are coated with Nickel Palladium Gold to prevent oxidation, allowing an unlimited life time storage while out of the bag and negligible loss of inventory. All leadless packages are Pb-free, RoHS and Dark Green compliant.