Slide 1 Slide 2 Slide 3 Slide 4 Slide 5 Slide 6 Slide 7 Slide 8 Slide 9 Slide 10 Slide 11 Slide 12 Slide 13 Slide 14 Slide 15 Slide 16 Product List
BLC-Slide16

In summary, ATS maxiGRIP™ and Board Level Cooling products provide a plastic frame clip that gently grips underneath BGA packages. Also, the “Double M” wire spring clip provides constant and even pressure on BGA over product lifetime. Finally, the product installation is done in three, easy steps.

PTM Published on: 2011-10-13