Decreasing thermal resistance allows more heat to be extracted to the air, and also reduces the heat applied to the board. This in turn cools the board which can increase the reliability of board mounted electronics. By lessening the pressure drop by using a maxiFLOW™ heatsink, the overall airflow across a board can be increased since the overall flow restriction is decreased. This not only affects the components which feature a maxiFLOW™ heatsink but also other board-cooled devices. Since the overall airflow increases, the heat transfer from the board increases and the board temperature decreases which in turn positively affects all board-mounted devices and can increase reliability across the board.