Installing the maxiFLOW™ is an easy three step process making it conducive for mid to high volume applications. Simply installing the frame clip, heatsink, then spring clip is all it takes. No pressure or curing time needed. Removal is easy and is rework friendly unlike some epoxies that destroy the BGA when the heatsink is removed. For expensive chips this can be very costly and wasteful. The maxiGRIP™ is an excellent and effective solution for these manufacturing problems.