Power Driver Modules

Results: 7
Packaging
Tape & Reel (TR)Tube
Product Status
ActiveObsolete
Type
IGBTMOSFET
Configuration
3 Phase3 Phase Inverter
Current
80 mA1 A2 A3 A
Voltage
500 V600 V
Voltage - Isolation
1000Vrms1500Vrms
Mounting Type
Surface MountThrough Hole
Package / Case
26-PowerDIP Module (0.573", 14.50mm)26-PowerDIP Module (0.846", 21.48mm)26-PowerSMD Module, Gull Wing
Stocking Options
Environmental Options
Media
Marketplace Product
7Results

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Configuration
Current
Voltage
Voltage - Isolation
Mounting Type
Package / Case
26-DIP Module
STIPN1M50T-H
SLLIMM-NANO SMALL LOW-LOSS INTEL
STMicroelectronics
467
In Stock
1 : ¥57.22000
Tube
Tube
Obsolete
MOSFET
3 Phase Inverter
1 A
500 V
1000Vrms
Through Hole
26-PowerDIP Module (0.846", 21.48mm)
26-DIP Module
STIPN2M50T-H
POWER DRVR MOD 500V 2A 26DIP MOD
STMicroelectronics
456
In Stock
1 : ¥67.07000
Tube
Tube
Active
MOSFET
3 Phase Inverter
2 A
500 V
1000Vrms
Through Hole
26-PowerDIP Module (0.846", 21.48mm)
26-DIP Module
STIPN2M50T-HL
POWER DRVR MOD 500V 2A 26DIP MOD
STMicroelectronics
522
In Stock
1 : ¥70.93000
Tube
Tube
Active
MOSFET
3 Phase Inverter
2 A
500 V
1000Vrms
Through Hole
26-PowerDIP Module (0.573", 14.50mm)
STGIPN3H60T-H
STGIPN3H60T-H
MOD IGBT SLLIMM NANO 26-NDIP
STMicroelectronics
36
In Stock
17 : ¥55.82176
Tube
Tube
Active
IGBT
3 Phase
3 A
600 V
1000Vrms
Through Hole
26-PowerDIP Module (0.846", 21.48mm)
37
In Stock
15 : ¥77.78000
Tube
Tube
Active
MOSFET
3 Phase Inverter
80 mA
600 V
1500Vrms
Through Hole
26-PowerDIP Module (0.846", 21.48mm)
NSDIP-26L
STIPNS1M50SDT-H
SLLIMM-NANO SMALL LOW-LOSS INTEL
STMicroelectronics
100
In Stock
Obsolete
Tape & Reel (TR)
Obsolete
MOSFET
3 Phase Inverter
1 A
500 V
1000Vrms
Surface Mount
26-PowerSMD Module, Gull Wing
24
In Stock
1 : ¥78.81000
Tube
Tube
Active
MOSFET
3 Phase Inverter
80 mA
600 V
1500Vrms
Through Hole
26-PowerDIP Module (0.573", 14.50mm)
Showing
of 7

Power Driver Modules


Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.