Adapter, Breakout Boards

Results: 13
Manufacturer
Adafruit Industries LLCAries ElectronicsChip Quik Inc.Logical Systems Inc.Texas Instruments
Series
-Correct-A-Chip®Proto-Advantage
Packaging
BoxBulk
Proto Board Type
SMD to DIPSMD to Plated Through Hole
Package Accepted
MSOP, SC70, SOIC, SOT23, SOT563, TSSOPMSOP, SOIC, TSSOPQFN, QFPSOICSOIC, TSSOPSOT-23, SOT-89, SOT-223, TO-252SSOP, TSSOPTO-252 (DPAK)TSSOP
Number of Positions
3681214162024283244
Pitch
0.026" (0.65mm)0.050" (1.27mm)0.091" (2.30mm)-
Board Thickness
0.062" (1.57mm) 1/16"-
Material
-FR4 Epoxy Glass
Size / Dimension
0.400" L x 0.300" W (10.16mm x 7.62mm)0.500" L x 0.500" W (12.70mm x 12.70mm)0.550" L x 0.425" W (13.97mm x 10.80mm)0.700" L x 0.600" W (17.78mm x 15.24mm)0.700" L x 0.700" W (17.78mm x 17.78mm)0.700" x 0.300" (17.78mm x 7.62mm)0.800" L x 0.700" W (20.32mm x 17.78mm)1.009" L x 0.700" W (25.63mm x 17.79mm)1.250" L x 0.750" W (31.75mm x 19.05mm)1.400" L x 0.700" W (35.56mm x 17.78mm)1.600" L x 0.700" W (40.64mm x 17.78mm)2.200" L x 0.800" W (55.88mm x 20.32mm)-
Stocking Options
Environmental Options
Media
Marketplace Product
13Results

Showing
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Proto Board Type
Package Accepted
Number of Positions
Pitch
Board Thickness
Material
Size / Dimension
1212
1212
SMT ADAP 6 PACK 8SOIC/MSOP/TSSOP
Adafruit Industries LLC
1,117
In Stock
1 : ¥24.22000
Bulk
-
Bulk
Active
SMD to DIP
MSOP, SOIC, TSSOP
8
-
-
-
0.550" L x 0.425" W (13.97mm x 10.80mm)
LCQT-SOIC8-8
LCQT-SOIC8-8
SOCKET ADAPTER SOIC TO 8DIP
Aries Electronics
6,332
In Stock
1 : ¥24.88000
Bulk
Bulk
Active
SMD to DIP
SOIC
8
0.050" (1.27mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.500" L x 0.500" W (12.70mm x 12.70mm)
1207
1207
SMT ADAPTERS 3 PAK 16SOIC/TSSOP
Adafruit Industries LLC
315
In Stock
1 : ¥32.43000
Bulk
-
Bulk
Active
SMD to DIP
SOIC, TSSOP
16
-
-
-
0.800" L x 0.700" W (20.32mm x 17.78mm)
DIP-ADAPTER-EVM
DIP-ADAPTER-EVM
MODULE EVAL DIP ADAPTER
Texas Instruments
245
In Stock
1 : ¥98.52000
Box
-
Box
Active
SMD to Plated Through Hole
MSOP, SC70, SOIC, SOT23, SOT563, TSSOP
6
-
-
-
-
PA0183
PA0183
TO-252 DPAK TO DIP-6 SMT ADAPTER
Chip Quik Inc.
171
In Stock
1 : ¥30.29000
Bulk
Bulk
Active
SMD to DIP
TO-252 (DPAK)
3
0.091" (2.30mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.700" x 0.300" (17.78mm x 7.62mm)
1206 SOIC-20
1206
SMT ADAPTERS 3 PACK 20SOIC/TSSOP
Adafruit Industries LLC
169
In Stock
1 : ¥36.94000
Bulk
-
Bulk
Active
SMD to DIP
SOIC, TSSOP
20
-
-
-
1.009" L x 0.700" W (25.63mm x 17.79mm)
1210
1210
SMT ADAPTERS 6 PACK 14SOIC/TSSOP
Adafruit Industries LLC
219
In Stock
1 : ¥40.64000
Bulk
-
Bulk
Active
SMD to DIP
SOIC, TSSOP
14
-
-
-
0.700" L x 0.700" W (17.78mm x 17.78mm)
1230
1230
SMT ADAPTERS 13 PACK
Adafruit Industries LLC
216
In Stock
1 : ¥40.64000
Bulk
-
Bulk
Active
SMD to DIP
SOT-23, SOT-89, SOT-223, TO-252
6
-
-
-
0.400" L x 0.300" W (10.16mm x 7.62mm)
1211
1211
SMT ADAPTERS 6 PACK 12SOIC/TSSOP
Adafruit Industries LLC
53
In Stock
1 : ¥40.64000
Bulk
-
Bulk
Active
SMD to DIP
SOIC, TSSOP
12
-
-
-
0.700" L x 0.600" W (17.78mm x 15.24mm)
LCQT-TSSOP28
LCQT-TSSOP28
SOCKET ADAPTER TSSOP TO 28DIP
Aries Electronics
73
In Stock
1 : ¥64.86000
Bulk
Bulk
Active
SMD to DIP
TSSOP
28
0.026" (0.65mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
1.400" L x 0.700" W (35.56mm x 17.78mm)
pa-ssd6sm18-24
PA-SSD6SM18-24
ADAPTER 24TSSOP TO 24DIP
Logical Systems Inc.
8
In Stock
1 : ¥98.52000
Bulk
-
Bulk
Active
SMD to DIP
SSOP, TSSOP
24
0.026" (0.65mm)
-
-
1.250" L x 0.750" W (31.75mm x 19.05mm)
1162 TQFP-44
1162
SMT ADAPTERS 3 PACK 44TQFP/QFN
Adafruit Industries LLC
24
In Stock
1 : ¥48.85000
Bulk
-
Bulk
Active
SMD to DIP
QFN, QFP
44
-
-
-
2.200" L x 0.800" W (55.88mm x 20.32mm)
1163 TQFP-32
1163
SMT ADAPTERS 3 PACK 32QFN/TQFP
Adafruit Industries LLC
23
In Stock
1 : ¥48.85000
Bulk
-
Bulk
Active
SMD to DIP
QFN, QFP
32
-
-
-
1.600" L x 0.700" W (40.64mm x 17.78mm)
Showing
of 13

Adapter, Breakout Boards


Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.