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TrenchFET Gen IV MOSFETs PowerPAIR Slide 16

The PowerPAIR family comes in 6x5 and 3x3 mmpackages. Amalgamating Gen IV and PowerPAIR proves most beneficial for integration and increasing switching frequency. These PowerPAIR devices contain a metal clip for source bonding which improves parasitic inductance. The evolution of PowerPAIR technology also allows scaling the package size to meet the output requirement.

PTM Published on: 2014-01-30