In summary, the three main ESD models are the human body model (HBM) which has the longest pulse width at 150 nS, followed by the machine model (MM) at 80 nS, and the charged device model (CDM) at 1 nS. Internal methods of ESD/EMI protection include inserting an IEC cell. As the IC process becomes more advanced and the level of protection increases, more space is required for the IEC cell. It becomes much more expensive to add an 8 kV IEC cell into a core design. An external EMI filter is simply a low-pass filter. This allows the signal to effectively pass with low loss, and attenuates out the unwanted EMI and RF. Texas Instruments’ integrated protection devices offer a solution that will protect against both ESD and EMI, in packages from the very small PicoStar which is meant for inclusion in the layers of the printed circuit board to the larger DBT package. These are application specific ESD, EMI solutions that are compatible with core microcontrollers or connector interfaces.