The opening diagram on this slide is a cross-section view of how Texas Instruments’ isolators are constructed. On the left, inputs are connected to the transmit chip, bond-wired to a receive chip, which then is connected to the output. This image is a bird's eye view of one channel of isolation of the multi-chip module construction, where it can be seen that the transmit chip takes the input signal and splits it to a low-frequency DC, or high-frequency channel. From there, it is passed through TI’s edge-based detection extraction method, which takes out the information from the high or low frequency signal on the input and transfers it to the receive side without connecting to the voltage. Next is a close-up of where the actual isolators are. The bond wire is connected to a top plate, and then put in through an inter-level dielectric which is a large amount of silicon dioxide (the insulating material used), and then a bottom plate, usually a silicon substrate that has been doped.