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TG-NSP35 Slide 9

This slide shows the value proposition for TG-NSP35 and outlines both the hard and the intangible cost savings represented by the use of a thermal putty compared to the more traditionally used materials. It is therefore essential that the designer considers the total cost of ownership for these materials and not only the materials costs as making an apples to apples conversion will not always give the full economic picture.

PTM Published on: 2014-09-16