TG-NSP35 is a thermal putty which does not require curing. This is a key point to take away from this presentation that the material is provided as a pre-cured material, this will reduce the process time, reduce the process costs and offers greater design flexibility. The material is highly confirmable, can be dispensed using common dispensing equipment and is also perfect for rework and repair, which is often a critical design consideration for the automotive industry. Not only does the material produce negligible stresses on components when compressed, it is non-silicone, reworkable and passes all the standard automotive tests. It is for this reason that the material has an exceptionally low total cost of ownership.