TG-NSP35 is a non-silicone based formulation which is loaded with conductive, ceramic filler and chemically cross-linked to form a low modulus putty with a thermal conductivity of 3.5 W/mk. Like a grease this material provides a low thermal impedance but unlike a grease it will not pump out or undergo any physical or chemical changes under environmental cycling. The product, being electrically non-conductive is designed for the automotive industry and for areas where stress on components generated must be kept to a minimum while maintaining excellent thermal transfer.