Wireless telecommunications systems often require high power electronics enclosed in a weather resistant electronic unit which may be deployed remotely, for example, at the top of a mast or tower near an antenna. Such units may be base transceiver stations for wireless communications, for example GSM band wireless communications used in North America and Europe. Power amplifiers for such applications have high distributed power, typically ˜200 W or more. Several high thermal flux components, 10 W to 50 W, may be mounted on individual circuit boards within the unit and if these are not cooled correctly, this may be detrimental to the performance and life time of the device. This is commonly reflected in the Mean time before failure. Historically, telecommunications and similar electronic equipment have been free convection cooled. Although the amount of heat that can be dissipated is relatively low, this has been acceptable because power dissipation densities typically were very low. With increased power densities, forced convection (fan) cooling was introduced. Though satisfactory equipment cooling is provided by the forced convection method, this method has a number of drawbacks. These drawbacks include cost, being added in the form of fans, the necessary mounting hardware and the required failure detection circuitry that must be provided. It is for this reason that passive cooling, a thermal interface material has become a popular and economical solution.