The AEC Q002 standard for statistical yield analysis is applied at die level (EWS) and the finished product. The statistical yield analysis has two guidelines, Statistical Yield Limit (SYL) and Statistical Bin Limit (SBL). In EWS when the lot is retested, the SYL will put in scrap each wafer, and whole lot, if the yields of good dice are lower than the values of the history of the last six or more lots tested. For the SBL the procedure is not for good dice, but for controlled bins. For example if a bin to control is the percentage of inoperative dice, or if a wafer or lot has more inoperative dice than the statistical limit, the wafer or the whole lot is scrapped. The SYA is applied also at the final test when the parts are assembled.