For the Dynamic PAT the first step is for all the dice on the wafers of a single diffusion lot are tested and inked in accordance with the test limits guaranteed in the datasheet. For each test, the values of the good dice are added to the values previously recorded in the previous diffusion lots. In the second step, during the retest of the lot, the new test limits for each test are the average value of the test (done with the distribution of all the values stored) ±6-sigma. For example, if the datasheet for a test guarantees minimum of 40 V, and the distribution of the test has the average ±6-sigma of 54 V and 46 V, a device with a value of between 40 V and 46 V or a value higher than 54 V in accordance with the standard procedure of testing is good, while for the automotive grade criteria this part is a failure. The Dynamic PAT is one of the most important improvements to the quality of a device, because it changes the approach to how the device is tested: from conformity to a specification to conformity to a statistical controlled process.