The current generated in the device in a small cell area can cause heating effects which eventually lead to failure. The larger cell area of the super-junction technology reduces the current density and the subsequent heat dissipation. The second benefit of the super-junction design is the location of the source metal, which is very close to where the heat is generated. The source metal acts as a very good heat sink to draw the heat away from the silicon into the copper top clip. The combination of these 2 features gives Nexperia T9 super-junction technology a big advantage in key parameters such as avalanche and safe operating area (SOA).