The MIC28304 eliminates the need to design, evaluate, test or procure discrete components. It is easy to lay out and place near active components, therefore minimizing the need to route long supply traces. The module also offers better EMI performance than discrete solutions because of the very close proximity of its internal components when compared to discrete solutions. Other benefits include vibration and humidity resistance because all the components of the MIC28304 are condensed inside the package. It also has reliability and simple design while at the same time offering great power efficiency compared to discrete solutions. All of these benefits lead to a shorter time to market than other solutions, and the space savings are about 60% of the board area when compared with a discrete solution.