The MIC28304 uses a copper lead frame which offers lower thermal resistance compared to PCB board modules or multi ball grid array modules. The copper lead frame also has lower electrical resistance that minimizes power losses that can be an issue in high current applications or with wide delta between input and output voltage. Hence, the copper lead frame technology enables Micrel’s devices to drive more current in very a small package. Micrel has spent a great amount of engineering time to design lead frames that allow customers to use a very simple landing pattern on PCB for easy manufacturing and reliability, without compromising the thermal derating.