Despite its small size, the ISL8203M is thermally efficient. It is able to conduct any heat present from switching loss directly into the PCB through the bottom of the package. This means that with a full 6A output at 2.5V providing 15W output, the device will see a case temperature of 65.8°C while running at room temperature with no airflow. This equates to a theta JA of 17°C/W. The advantage is that this device can run at maximum ambient temperature, 85°C full load without the need for air flow. Therefore no heat sinking is required for this product. By evenly dissipating the heat throughout the package, the die is able to maintain a constant temperature which increases the reliability of the power module without heat sinks or other external cooling methods.